390261-3

TE CONNECTIVITY

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Straight through-hole dual-row 14-position low-profile ladder-style dual-wipe Integrated Circuit (IC) DIP socket featuring a standard 0.100-inch (2.54mm) pitch and a 0.300-inch (7.62mm) row spacing. Equivalents: TE Connectivity 1-390261-3, Molex 2227-2141, Amphenol DILB14P-223TLF. Real-Life Examples: Operational amplifier arrays (e.g., LM324), basic TTL logic chips, vintage synthesizer voice sub-modules.

SPEM168