390261-5

TE CONNECTIVITY

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Straight through-hole dual-row 18-position low-profile ladder-style dual-wipe Integrated Circuit (IC) DIP socket featuring a standard 0.100-inch (2.54mm) pitch and a 0.300-inch (7.62mm) row spacing. Equivalents: TE Connectivity 1-390261-5, Jameco Valuepro 18LP-S, Aries Electronics 18-300-10. Real-Life Examples: Microcontroller support chips, early computing dynamic RAM (DRAM) memory banks, specialized optocoupler isolation boards. [1, 2, 3, 4, 5]

SPEM168